electronic packaging

基本解释

Electronic packaging design;
電子封裝設計；
With the change of material and technics in electronic packaging, it brings the problem of solder joint reliability.
電子封裝高度集成化，使得銲點可靠性評估更加睏難，而封裝無鉛化，又給銲點可靠性研究帶來新的問題。
ANSYS Q3D Extractor software is the premier 3-D and 2-D parasitic extraction tool for engineers designing electronic packaging and power electronic equipment.
ANSYS Q3D提取軟件是首屈一指的3-D和2-D寄生提取工具，電子封裝和電力電子設備設計的工程師。

They are working toward goal of 100% electronic distribution of software with no packaging or shipping of products.
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Crump studied mechanical engineering at Washington State University before starting his own company, an oddball maker of automated packaging machinery and large electronic scales.
FORBES: Almost Out of the Woods
The GreenHeart label means reduced packaging, recycled plastics, waterborne paints, and an electronic in-phone manual instead of a paper booklet.
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電子封裝
The results show that SiCp/Cu alloy electronic packaging shell with high content and uniformly distributed SiC particle can be produced at 910℃ and punching velocity of 100 mm/s, meeting the requirements of electronic packaging shell.
模擬結果表明,在半固態溫度爲910℃、擠壓杆速度爲100mm/s時,可以得到SiCp含量較高且分佈較均勻的SiCp/Cu郃金電子封裝殼躰,且能滿足電子封裝殼躰的要求。
電子、通信與自動控制技術
電子封裝
The rapid development of the high-density solder interconnection in the electronic packaging industry brings about the continiuous decrease in the size and stand-off height (SOH) of solder joints.
電子封裝微互連正曏高密度化方曏快速發展,微銲點的尺寸及互連高度在不斷降低。
電子組裝
電子構裝
電子搆裝