underfill

常见例句

DU901 is a one component, epoxy encapsulant designed for use as a repairable underfill resin for CSP or BGA.
简介：道尔DU901是一种单组分环氧密封剂，用于CSP或BGA底部填充制程。
T hen show that correct underfill can dramatically increase thermal reliability.
通过正确的底部填充，可提高倒装芯片组装的成品率和可靠性。
This makes complete sense, and it is followed by a picture of a modern chip with the bumps and underfill pointed out.
这使得完整意义上说，这是其次的图片现代芯片的颠簸和底层指出。
The results show that the residual moisture within underfill materials enhances the stress level in solder joint.
结果表明：在湿热环境下，底充胶材料内部残留的湿气提高了焊点的应力水平。
A cure-dependent viscoelastic model was applied to describe the mechanical behavior of underfill.
利用有限元仿真的方法，模拟了无铅倒装封装器件封装的工艺及可靠性测试。
Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。